The Z3T^H Combined Module is enlarging the scope of modules that can sit on top of the existing XY platforms. The Z3T^H, 4 degrees of freedom module, provides 364° Theta rotation, double Z-axes, a coarse one for wafer loading and unloading, and a fine one for focus adjustment, as well as a Tip and Tilt correction over ±0.1°. This Z3T^H module is a nice alternative to piezo based Z actuators, eliminating the hysteresis and non-linearity in open loop while offering better tracking error during movement, repeatability, and move and settle performance yet over much longer travels.

The Z3T^H module is primarily dedicated to front-end type of applications and provides a right solution to cope with any applications requiring:

• Alignment between a process tool and a substrate
• Mapping of flatness
• Move and settle improvement

First applications are related to back-end lithography and wafer process control.

Characteristics

• 364° Theta rotation
• Tip and tilt correction over ±0.1° for leveling and for move and settle improvement
• Vacuum feed-through to the chuck level
• Double Z integration: coarse travel for loading/unloading and fine travel for focus adjustment
• ISO class 1 clean room compatibility
• Low radial axial and radial runout of ±1 µm