METIS Planar platform

This platform, METIS, is a hybrid planar mechanical/air bearing platform dedicated to step and scan applications. It is a 6 axes platform moving in X, Y, Z and Theta directions. Dynamic flatness over the full travel as well as bidirectional repeatability are key parameters. This platform is currently used in:

Wafer Process Control applications such as Critical Dimension and Thin film Metrology.
Wafer scribing
Wafer Laser Thermal Annealing

It might also be used in Back End Of Line Lithography machines (mask aligners) and in some wafer dicing application.

This platform features:

Flatness of motion given by the air bearing
Unlimited rotation in Theta
Double Z integration: Coarse travel for loading/unloading and fine travel for focus adjustement
Buit-in gravity compensator in Z
Yaw correction can be done by slightly shifting the Y1 and Y2 motors
Can be further integrated with an Active Isolation System fully controlled by ETEL
Travels in X and Y can be made longer with some limitations on the performance

Main specifications

Description	Y1,Y2	X	Fine Z	Coarse Z	Theta
Total stroke	320 mm	320 mm	4 mm	12 mm	infinite
Maximum speed	1.2 m/s	1.2 m/s	0.1 m/s	0.02 m/s	15.7 rad/s
Maximum acceleration	12 m/s2	12 m/s2	2 m/s2	1 m/s2	104.7 rad/s2
Position stability	±25 nm	±25 nm	±15 nm	-	±0.2 arcsec
Bidirectional repeatability	±0.4 µm	±0.4 µm	±0.3 µm	-	±2 arcsec
Maximum payload	1 kg

Ask for the corresponding Integration Manual for more information.

Description	Data sheet	Interface drawing	3D model
METIS			On request

METIS Planar platform

Main specifications

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